DISCO DFG8560 other

Object of action: Wafer

Maximum machining  wafer size: Φ300mm

spindle: 2

Number of chuck  gauges: 3

Compatible models: DFG800 SEREINes

Overall Footage: approximately 1400*3190*1800mm

grinding wheel specification: Diamond grinding wheel, with a diameter up to 300mm

Rated output power: 4.8kW

Grinding speed range: 1000-7000Rpm(under normal circumstances

Grinding precision

① Thickness error within a single wafer: extremely small, usually controlled at the micrometer level, such as below 1.5μm

② Thickness error between wafers: It is also controlled at the micrometer level to ensure that the wafers processed in batches have consistent thickness

③ Surface roughness: The Ry value can reach 0.13μm (completed with #2000 grinding wheel) or 0.15μm (completed with #1400 grinding wheel).