Seibu M75A Wire cutting machine

Three-axis Travel (X/Y/Z): Approx. 650 × 550 × 230 mm
U/V-Axis Travel: ±60 mm (supports taper cutting)
Maximum Machining Thickness: 400 mm
Maximum Taper Angle: 45° (optional)
Electrode Wire Diameter Range: Φ0.07–0.3 mm
Wire Tension: 2–25 N
Wire Feeding Speed: Below 0.2 m/s (up to 0.5 m/s with certain configurations)
Machining Accuracy: Pitch accuracy ±1 μm; repeat positioning accuracy 0.01 mm
Surface Roughness: Ra 0.2–0.8 μm; achievable Ra 0.05 μm after fine finishing
CNC System: Self-developed SmartNC CNC system, supporting graphical programming and multi-axis simultaneous control
Working Fluid: Deionized water (conductivity below 10 μS during fine finishing)
Ambient Temperature Requirement: 20 ± 1°C (the equipment guarantees its specified accuracy within an ambient temperature range of 20 ± 3°C)
Main Unit Weight: Approx. 2,900 kg
Power Supply Requirements: Three-phase, 380 V / 50 Hz; total power approx. 50 kVA