DISCO DFG8560 other

Object of action: wafer

Maximum machining  wafer size: Φ300mm

spindle Number: 2

chuck  Worktable number: 3

Compatible model: DFG800 SEREINes

Footage: about 1400*3190*1800mm

grinding wheel specification: diamond grinding wheel, diameter up to 300mm

Rated output power: 4.8kW

Grinding speed range: 1000-7000Rpm(general)

Grinding precision:

The thickness error in a single wafer: very small, usually controlled in the MIKRON level, such as 1.5μm below

(2) Inter-wafer thickness error: also controlled in the MIKRON level, to ensure that the batch machining  wafers have a consistent thickness

③ Surface roughness: Ry value can reach 0.13μm (using #2000 grinding wheel) or 0.15μm (using #1400 grinding wheel)