• Inventory number：87135
• Brand：DISCO
• Model：DFG8560
• Origin：Japan
• Location：China
• Year：2005
• Create Time：2025-04-15

Specifications:

• Object of action: wafer

  Maximum machining  wafer size: Φ300mm

  spindle Number: 2

  chuck  Worktable number: 3

  Compatible model: DFG800 SEREINes

  Footage: about 1400*3190*1800mm

  grinding wheel specification: diamond grinding wheel, diameter up to 300mm

  Rated output power: 4.8kW

  Grinding speed range: 1000-7000Rpm(general)

  Grinding precision:

  The thickness error in a single wafer: very small, usually controlled in the MIKRON level, such as 1.5μm below

  (2) Inter-wafer thickness error: also controlled in the MIKRON level, to ensure that the batch machining  wafers have a consistent thickness

  ③ Surface roughness: Ry value can reach 0.13μm (using #2000 grinding wheel) or 0.15μm (using #1400 grinding wheel)